Institute for Compound Semiconductors

The Institute for Compound Semiconductors (ICS) is an innovative concept working at the interface of academia and industry, providing world-class fabrication and testing facilities for users to develop and test their research, and to prepare it for exploitation by industry.

Equipment

Name	Make/Model	Details
Evaporator 4	Lesker, Pro Line PVD200	Thin film deposition system - thermal or e-beam metals -Al, Au, Ag, Cr, Zn, Ti, Ni. Sputter- Al, ITO and NiCr.
Evaporator 5	Lesker, Pro Line PVD200	Thin film deposition system with UHV Egun system - thermal or e-beam metals- Al, Au, Ti, Pt, Ni, AuGe
Evaporator 6	BUHLER, Boxer, dielectric evaporator.	With ebeam gun - thermal or e-beam metals- Al, Au, Ti, SiO2. Sputter- SiO2 and SiN.
ICP-RIE Etch tool	Oxford Instruments, PlasmPro 100 Cobra 300.	Plasma etch tool - III-V, GaN, SiN etching.
Rapid Thermal Annealer	JIPELEC, Jetfirst 300 RTP Processor 3 x 400V.	Annealing of metal-semiconductor contacts over 300mm with a controlled N2 or O2 atmosphere. Thermocouple or pyrometer temperature control upto 1200 °C.
6" mask aligner	SÜSS MicroTec, MA6 Mask Aligner.	Photolithographic tool with a 1000W Hg UV lamp. Soft, hard, vacuum and soft-vacuum contact modes.
Wet Oxidation Furnace	AET, ALOX furnace.	With 6" chamber and susceptor.
High Resolution SEM	Hitachi, Regulus8230	High resolution SEM imaging, with EDX X-Flash and FlatQuad detectors.
Axio Imager	Zeiss, Z2 Vario.	High quality microscope for imaging and measurement of critical dimensions over 200mm. Semi-auto mapping available.
Atomic Layer Deposition (ALD)	Beneq, ALD, Thin Film System TFS200*	ALD deposition of TiO2, TiN, Ta2O5, Al2O3, ZnO, SiO2, SiN, NiO, ITO, MoO.
X-Ray Diffractometer (XRD)	X'Pert3 MRD XL.	To characterise thin film based optoelectronic devices.
Evaporator 7	Moorfield - minilab ET80A	Loadlocked PVD system with Ar sputter clean preparation. Suitable for samples up to 6” wafer size, with thermal and e-beam capabilities.
Evaporator 8	Moorfield - minilab S060M	Open chamber PVD system, suitable for samples up to 6” wafer size, with sputter capabilities.
4" mask aligner	SÜSS MicroTec, MJB4 Mask Aligner	The MJB4 is a versatile and flexible aligner solution for handling standard and non-standard substrates.
8" mask aligner	SÜSS MicroTec, MA08 Gen4 Mask Aligner	Semi-automated mask and bond aligner with diffraction-reducing optics.
Desktop SEM	PhenomXL G2 Desktop SEM	Desktop scanning electron microscope (SEM) with energy dispersive spectroscopy (EDS).
Keyence microscope	Keyence VHX-7100	A 4K ultra-high accuracy digital microscope.
Mask Cleaner	HMx9 Mask Cleaner	The HMx9 is manually loaded with automatic sequential processing, designed for high-quality mask or substrate cleaning.
Maskless optical lithography system	Heidelberg, MLA150 System	A maskless optical lithography tool that uses a 2-dimensional Spatial Light Modulator to project patterns directly onto resist coated wafers.
MCS8	SUSS MicroTec, MCS8	A modular system for photoresist coating of wafers.
Aqueous Developer	SUSS MicroTec, AD12	A manual wet-processing system for aqueous media applications.
Solvent Developer	SUSS MicroTec, SD12	A manual wet-processing system for cleaning and lift-off functions for solvent media applications.
Profilometer	DektakXT Advanced System (DXT-A)	General purpose surface profiler with versatility and repeatability (4angstroms).
E Line	RAITH, EBL	Electron beam lithography tool.
Ultra-high performance electron beam lithography system	RAITH, EBPG 5200 plus	A 100kV ultra-high-performance electron beam lithography system suitable for nanoscale writing at frequencies up to 125MHz.
6" dicing saw	Loadpoint Nanoace 3	A 6" dicing saw
8" dicing saw	ADT, 7900 DUO 8" dicing system	8" dicing saw

Institute for Compound Semiconductors

Equipment

Get in touch

Chris Matthews

Location

Research equipment

Contact us