Introduction to Wire Bonding
This course will upskill you in a theoretical and practical knowledge of the wire bonding process as a key microelectronic interconnection technique.
This will help you understand how wire bonding equipment works and will also inform better decision making when implementing the wire bonding process.
Gain theoretical and practical understanding of the wire bonding process as a key microelectronic interconnection technique.
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There are currently no upcoming dates available for this course, but you can register your interest. We will be in touch when a new course date is scheduled.
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Who it’s for
Anyone exposed to or developing the wire bonding process.
This course has been designed for employees of the compound semiconductor cluster in South Wales (known as CSconnected), and specifically those working in the packaging of semiconductor modules and devices.
The training could also be relevant for those working in the semiconductor sector globally, as well as for their supply chain partners and anyone else interested in a knowledge of wire bonding.
What you’ll learn
By the end of the course, you will be able to:
- explain what wire bonding is and its function within the wider semiconductor supply chain (i.e. as a packaging process)
- understand the performance expected from a good wire bond
- describe, in simple terms, the generic step-by-step processes involved in wire bonding and how the machinery works
- explain the similarities and differences between ball bonding, wedge bonding, and ribbon bonding techniques, including their pros and cons
- know which materials can be used in the wire bonding process and which materials to select according to the outcomes that you need
- understand the different parameters that affect the ‘recipe’ when wire bonding and how changing the parameters affects the outcome
- know how to validate the quality of wire bonding through pull tests and shear tests
- know about the main safety issues to be aware of when wire bonding
- know the professional standards used for wire bonding
Topics covered
- Examples of wire bonding and machinery
- Materials used for wire bonding
- Steps in the wire bonding process, including:
- Known wire material requirements
- Target sample/product setting
- Pre-recipe searching
- Bonding
- Ball and wedge bonding techniques
- Parameters affecting the ‘recipe’, including:
- Time
- Ultrasonic Power
- Force
- Temperature
- Wire materials – Gold, Aluminium, Copper
- Ball, wedge, and ribbon bonding
- Wire shape – tail, bridge height, etc
- Fundamentals of ultrasonic, thermosonic, and thermocompression bonding
- Current carrying capacity and fusing limits
- Metallurgical interactions
- Trouble-shooting – what can go wrong during processing and in service
- Advanced wire/ribbon bonding processes – laser and laser/ultrasonic
- Equipment manufacturers and the supply chain
- Validation of the process – quality and tests
- Wire pull
- Ball shear
- Wire pull and ball shear failure mode interpretation (ball lift, shear, wire break on 1st, 2nd bond)
- Loop height
- Ball diameter
Benefits
This course has been designed in collaboration with industry partners from the CSconnected cluster, the world’s first compound semiconductor cluster based in and around South Wales in the United Kingdom, and using funding provided by UKRI’s Strength in Places Fund.
Further information
Cardiff University’s Continuing Professional Development (CPD) Unit is managing the organisation of this course.
Cardiff University is partnering with iMAPS-UK to deliver this event. iMAPS-UK is a Society which aims to support the development and growth of the microelectronics and related industries. Cardiff University has expertise in wire bonding, through their Institute for Compound Semiconductors.
Course leads
Dr Daniel Wang, Cardiff’s Institute of Compound Semiconductors (ICS)
Steve Riches, iMAPS-UK
Andy Longford, iMAPS-UK
Sirin Sunny, Accelonix UK
Funding available
For individuals
- ReAct+ - up to £1,500 for relevant skills training for those 18+ who are resident in Wales and unemployed or under formal notice of redundancy. For more details, click here
For organisations
- Flexible Skills Programme funding – up to 50% funding support to Wales-based businesses. For details, click here
- ReAct+ - up to £1,000 for job-related skills training when recruiting someone 18+ who is resident in Wales and unemployed or under formal notice of redundancy. For more details, click here